Direct Patterning on Porous Surface Using Drop Impact Printing

Reddy, BS and Dey Modak, C and Lathia, R and Agarwal, B and Ebinesh Abraham, R and Sen, P (2023) Direct Patterning on Porous Surface Using Drop Impact Printing. In: 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023, 15-19 January 2023, Munich, pp. 1049-1051.

PDF mems_2023.pdf - Published Version Restricted to Registered users only Download (1MB) | Request a copy

Abstract

This work reports the direct printing of highly concentrated nanoparticle inks on porous surfaces using a simple, low-cost sieve-based technique. The formulated ink has a seven-fold higher concentration as compared to conventional printer inks. On porous surfaces, highly concentrated ink reduces drop spreading by ∼ 33% and penetration by ∼ 55%. Printing such high-concentration inks exhibits extremely high conductivity of 3.7 x 103 S/m for a single pass print. This work demonstrates novel high-conductive printing possibilities on porous surfaces for developing flexible/wearable sensors and electronic applications. The technique further removes the constraints in ink palettes and substrate dependency.

Item Type:	Conference Paper
Publication:	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Publisher:	Institute of Electrical and Electronics Engineers Inc.
Additional Information:	The copyright for this article belongs to Institute of Electrical and Electronics Engineers Inc.
Keywords:	MEMS; Sieves, Direct printing; Direct-patterning; Drop Impact; Droplets impact; Mass loadings; Nanoparticle inks; Porous surface; Simple++; Superhydrophobic; Superhydrophobic sieve, Drops
Department/Centre:	Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited:	28 Mar 2023 09:21
Last Modified:	28 Mar 2023 09:21
URI:	https://eprints.iisc.ac.in/id/eprint/81181

Actions (login required)

View Item