Enhancement of quenching heat transfer performance through destabilization of vapor film

Venkitesh, V and Dash, S (2023) Enhancement of quenching heat transfer performance through destabilization of vapor film. In: International Journal of Heat and Mass Transfer, 204 .

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Abstract

Film boiling is typically the rate-limiting process during quenching relevant to manufacturing, material processing, and vitrification. Here, we report on the effect of macroscale surface extends (fins) and microscale textures on the enhancement of quenching heat transfer performance. At a quench pool temperature of 80 °C, the pin-finned surfaces with hierarchical roughness decrease the quench duration by 4.5 times, 3.4 times, and 1.3 times compared to a plane, annular-finned, and pin-finned substrates, respectively. Annular and pin-finned surface extends influence the vapor geometry in the film boiling regime and trigger a premature collapse of the vapor film on vertical cylinders, elevating the minimum film boiling temperature. The pin fins enable higher heat transfer in the film and transition boiling regimes by disrupting the vapor film while providing a pathway for vapor escape, unlike annular fins. The hierarchical surfaces with microtextures etched on the pin fins further increase heat dissipation by offering nucleation sites. We discuss the role of surface textures on the range of temperatures that sustain the transition boiling regime during quenching. © 2023

Item Type:	Journal Article
Publication:	International Journal of Heat and Mass Transfer
Publisher:	Elsevier Ltd
Additional Information:	The copyright for this article belongs to Elsevier Ltd.
Keywords:	Evaporation; Heat flux; Heat transfer; Quenching; Textures, Film boiling; Finned surface; Heat transfer performance; Hierarchical surfaces; Maximum heat flux; Micro-texture; Pin-fins; Quenching; Transition boiling; Vapor films, Cylinders (shapes)
Department/Centre:	Division of Mechanical Sciences > Mechanical Engineering
Date Deposited:	16 Feb 2023 03:35
Last Modified:	16 Feb 2023 03:35
URI:	https://eprints.iisc.ac.in/id/eprint/80281

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