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Fantastic bonding: makes fabrication on Kapton films effortless for 2D material devices

Yarajena, SS and Naik, AK (2022) Fantastic bonding: makes fabrication on Kapton films effortless for 2D material devices. In: 22nd IEEE International Conference on Nanotechnology, NANO 2022, 4 - 8 July 2022, Palma de Mallorca, pp. 367-370.

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Official URL: https://doi.org/10.1109/NANO54668.2022.9928714


In this study, we propose a simple temporary bonding method to bond Kapton films to the carrier wafer (silicon). It involves using a clean elastomer film as an intermediate layer for bonding. After the fabrication process, the substrate can be auto-released just by controlling the acetone (solvent) treatment time. The proposed method does not require any specialized equipment for the bonding. Using this method, we have fabricated 2D-material-based devices on Kapton films bonded to the carrier wafer using conventional nanofabrication methods. Devices fabricated on the released Kapton films are tested by performing strain-dependent electrical characterization. The technique presented would be of significant interest to fabricate devices on Kapton substrates for piezotronics, wearable electronics, sensors, and many others. © 2022 IEEE.

Item Type: Conference Paper
Publication: Proceedings of the IEEE Conference on Nanotechnology
Publisher: IEEE Computer Society
Additional Information: The copyright for this article belongs to IEEE Computer Society.
Keywords: Fabrication; Mechanics; MEMS; Nanotechnology; Polyimides; Silicon wafers; Substrates; Wafer bonding, Bonding methods; Carrier wafers; Elastomer films; Fabrication process; Intermediate layers; Kapton films; Simple++; Solvent treatment; Temporary bondings; Treatment time, Acetone
Department/Centre: Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited: 09 Jan 2023 07:05
Last Modified: 09 Jan 2023 07:05
URI: https://eprints.iisc.ac.in/id/eprint/78908

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