Yarajena, SS and Naik, AK (2022) Fantastic bonding: makes fabrication on Kapton films effortless for 2D material devices. In: 22nd IEEE International Conference on Nanotechnology, NANO 2022, 4 - 8 July 2022, Palma de Mallorca, pp. 367-370.
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Abstract
In this study, we propose a simple temporary bonding method to bond Kapton films to the carrier wafer (silicon). It involves using a clean elastomer film as an intermediate layer for bonding. After the fabrication process, the substrate can be auto-released just by controlling the acetone (solvent) treatment time. The proposed method does not require any specialized equipment for the bonding. Using this method, we have fabricated 2D-material-based devices on Kapton films bonded to the carrier wafer using conventional nanofabrication methods. Devices fabricated on the released Kapton films are tested by performing strain-dependent electrical characterization. The technique presented would be of significant interest to fabricate devices on Kapton substrates for piezotronics, wearable electronics, sensors, and many others. © 2022 IEEE.
Item Type: | Conference Paper |
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Publication: | Proceedings of the IEEE Conference on Nanotechnology |
Publisher: | IEEE Computer Society |
Additional Information: | The copyright for this article belongs to IEEE Computer Society. |
Keywords: | Fabrication; Mechanics; MEMS; Nanotechnology; Polyimides; Silicon wafers; Substrates; Wafer bonding, Bonding methods; Carrier wafers; Elastomer films; Fabrication process; Intermediate layers; Kapton films; Simple++; Solvent treatment; Temporary bondings; Treatment time, Acetone |
Department/Centre: | Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering |
Date Deposited: | 09 Jan 2023 07:05 |
Last Modified: | 09 Jan 2023 07:05 |
URI: | https://eprints.iisc.ac.in/id/eprint/78908 |
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