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Thermal conductivity studies on activated carbon based cryopanel

Verma, R and Nagendra, HN and Kasthurirengan, S and Shivaprakash, NC and Behera, U (2019) Thermal conductivity studies on activated carbon based cryopanel. In: 27th International Cryogenics Engineering Conference and International Cryogenic Materials Conference 2018, ICEC-ICMC 2018, 3 - 7 September 2018, Oxford.

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Official URL: https://doi.org/10.1088/1757-899X/502/1/012197


The adsorbent temperature is one of the important parameters for pumping speed of cryosorption pump, which depends on thermal conductivity of the cryopanel. An attempt has been made to measure the thermal conductivity of the developed small size cryopanel which consist of a copper panel coated with adhesive to adhere the activated carbon adsorbent. This arrangement is similar to commercially available cryosorption pump. The thermal conductivity of the above panel has been measured with the help of cryocooler based experimental setup developed in our laboratory. The thermal conductivity of the cryopanel is further improved by mixing fine aluminium powder into the adhesive which in turn will cool the adsorbent to the lowest possible temperature. This will enhance the pumping speed of the crysorption pump. These studies on the thermal conductivity of cryopanels will be useful for the development of high performance cryosorption pumps.

Item Type: Conference Paper
Publication: IOP Conference Series: Materials Science and Engineering
Publisher: Institute of Physics Publishing
Additional Information: The copyright for this article belongs to the Authors.
Keywords: Activated carbon; Adhesives; Cryogenics; Pumps, Aluminium powder; Cryocoolers; Cryopanels; Cryosorption pumps; Made-to-measure; Pumping speed, Thermal conductivity
Department/Centre: Division of Physical & Mathematical Sciences > Centre for Cryogenic Technology
Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics
Date Deposited: 25 Oct 2022 08:36
Last Modified: 25 Oct 2022 08:36
URI: https://eprints.iisc.ac.in/id/eprint/77519

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