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Short communication: Assessment of the dislocation density using X-ray topography in Al single crystals annealed for long times near the melting temperature

Singh, SP and Huang, X-R and Kumar, P and Kassner, ME (2019) Short communication: Assessment of the dislocation density using X-ray topography in Al single crystals annealed for long times near the melting temperature. In: Materials Today Communications, 21 .

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Official URL: https://doi.org/10.1016/j.mtcomm.2019.100613

Abstract

Earlier work by the authors determined the dislocation density as a function of time in aluminum single crystals annealed near the melting temperature using etch-pits. It was found that the dislocation density is stable and unchanged even with annealing times up to one year for statically annealed Al single crystals with an initially low dislocation density. As several investigators have suggested that etch-pits are not reliable compared to transmission electron microscopy in assessing the dislocation density, the current study utilized x-ray topography at a synchrotron for dislocation density measurements. This work, then, is a short paper complementing the authors earlier work by using a new, reliable, but rarely utilized non-destructive technique to measure the dislocation density. The results confirm the trend of the earlier study using etch-pits by the authors.

Item Type: Journal Article
Publication: Materials Today Communications
Publisher: Elsevier Ltd
Additional Information: The copyright for this article belongs to the Authors.
Keywords: Annealing; High resolution transmission electron microscopy; Melting point; Nondestructive examination; Single crystals; Topography; X rays, Aluminum single crystals; Dislocation densities; Etch pits; Function of time; Low-dislocation density; Non-destructive technique; X-ray topography, Dislocations (crystals)
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 12 Oct 2022 09:33
Last Modified: 12 Oct 2022 09:33
URI: https://eprints.iisc.ac.in/id/eprint/77401

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