High throughput determination of creep behavior of additively manufactured AlSi10Mg alloy

Singh, SP and Jayaram, V and Srinivasan, D and Kumar, P (2022) High throughput determination of creep behavior of additively manufactured AlSi10Mg alloy. In: Additive Manufacturing, 58 .

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Abstract

Power-law creep behavior of laser powder bed fusion (LPBF) AlSi10Mg alloy is evaluated at 250 °C under uniaxial and bending test conditions. Uniaxial tests are performed in both tension and compression, and the cantilever samples are tested using digital image correlation (DIC)-augmented-bending test methodology, which is a way of establishing creep parameters in high throughput fashion. In each test condition, the applied normal stress is along the transverse direction relative to the build direction. The creep response of the alloy exhibits a tension-compression symmetry in terms of the steady-state and minimum creep rates. Correlations of uniaxial and high throughput bending creep tests reveal an excellent correspondence, thereby establishing the viability of evaluating creep behavior via bending, as a first of its kind, for additively manufactured Al alloys. Detailed electron microscopy of the crept specimens revealed the stability of microstructure during the prolonged exposures up to 500 h (during uniaxial creep) and the pinning of dislocations by intra-granular Si (20–50 nm) particles. A detailed discussion on the structure-property relationships is provided.

Item Type:	Journal Article
Publication:	Additive Manufacturing
Publisher:	Elsevier B.V.
Additional Information:	The copyright for this article belongs to the Elsevier B.V.
Keywords:	3D printers; Additives; Aluminum alloys; Creep; Creep testing; Image correlation; Strain measurement, Bending creep; Creep behaviors; Digital image correlations; High throughput testing; High-throughput; Laser powders; Powder bed; Power law creep; Test condition; Uniaxial tests, Bending tests
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	22 Aug 2022 11:58
Last Modified:	22 Aug 2022 11:58
URI:	https://eprints.iisc.ac.in/id/eprint/76146

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