Parab, V and Ding, L and Kumar, A and Yaswant, V and Sambandan, S (2018) Self-healing interconnects for reliable flexible electronics. In: 233rd Meeting of the Electrochemical Society, 13 - 17 May 2018, Seattle, pp. 825-831.
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Abstract
In order to build flexible electronic systems that can bend in two directions simultaneously, it is required that the substrate be able to stretch easily. This is achieved by the use of elastomeric substrates. Stretchable and bendable electronics reduces the reliability of the interconnect. Factors such as stretching, electrostatic discharge, interaction with the environment etc. Increases the chance of interconnect failure due to open circuit faults. This paper describes a mechanism of self-healing open circuit faults by the use of a dispersion of conductive particles in an insulating fluid. Faults are typically repaired in 10s with the heal having a resistance of 10 Ohm-1000 Ohm. The paper provides an overview and the operational limits that determine the feasibility of using the technique to improve interconnect reliability in flexible electronics.
Item Type: | Conference Paper |
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Publication: | ECS Transactions |
Publisher: | Electrochemical Society Inc. |
Additional Information: | The copyright for this article belongs to the Electrochemical Society Inc. |
Keywords: | Electrostatic devices; Flexible electronics; Self-healing materials, Conductive particle; Elastomeric substrates; Flexible electronic systems; Insulating fluid; Interconnect failure; Interconnect reliability; Open circuit faults; Operational limits, Substrates |
Department/Centre: | Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics |
Date Deposited: | 22 Aug 2022 10:32 |
Last Modified: | 22 Aug 2022 10:32 |
URI: | https://eprints.iisc.ac.in/id/eprint/75988 |
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