Heterogeneous Integration by the 3D Stacking of Thin Silicon Die

Nittala, PVK and Haridas, K and Sen, P (2022) Heterogeneous Integration by the 3D Stacking of Thin Silicon Die. In: 72nd IEEE Electronic Components and Technology Conference, ECTC 2022, 31 May - 3 June 2022, San Diego, pp. 608-613.

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Abstract

A 3-D integration method for stacking multiple components will be demonstrated in this paper. The methodology involves the stacking of a thin silicon (10 μm thickness wafer) photo detector and a bulk-silicon detector. This will be achieved by the transfer of a thin silicon photo detector on top of another photo detector. Overall, the miniaturized system works towards a microfluidics-based fluorescence detection system to detect two wavelengths. In this demonstration green and red wavelengths will be detected while filtering or blocking the blue light. This system involves the integration of dissimilar materials like thin silicon photo detector, bulk-si (thick silicon) photo detector, plastic optical filter, glass microfluidic chip, and a commercial LED. The thin-silicon wafer in the stack will not only be used as a detector, but also used as a filter for the second detector.

Item Type:	Conference Paper
Publication:	Proceedings - Electronic Components and Technology Conference
Publisher:	Institute of Electrical and Electronics Engineers Inc.
Additional Information:	The copyright for this article belongs to the Institute of Electrical and Electronics Engineers Inc.
Keywords:	Dissimilar materials; Fluorescence; Mechanics; MEMS; Microfluidics; Photodetectors; Silicon detectors; Silicon wafers; Three dimensional integrated circuits; Wafer bonding, 3-D integration; 3D stacking; Bonding; Epoxy; Heterogeneous integration; Heterogenous integration; Photo-detectors; Silicon die; Silicon photo-detector; Stackings, Integration
Department/Centre:	Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited:	10 Aug 2022 06:27
Last Modified:	10 Aug 2022 06:27
URI:	https://eprints.iisc.ac.in/id/eprint/75799

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