Maharshi, V and Mere, V and Agarwal, A (2019) Multi-Layered Thermal Actuator Realization Using Metal Passivated TMAH Micro-Machining. In: IEEE Electron Device Kolkata Conference, EDKCON 2018, 24 - 25 November 2018, Kolkata, West Bengal, pp. 392-395.
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Abstract
This paper presents fabrication of thermally actuated multi-layered micro actuator for out of plane actuation application. Multi-layered actuators are fabricated using ammonium per sulphate based TMAH etching with metal passivation. Multi-layered Au Si3N4SiO2 micro actuators with straight and cross-heaters are characterized using I-V and LDV measurements. Gold as upper layer of micro actuator is fully protected during the release process. Fundamental mode or resonant frequency of fabricated multi-layered micro actuator is measured by Laser Doppler Vibrometer which is observed around 20 KHz.
Item Type: | Conference Paper |
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Publication: | Proceedings of International Conference on 2018 IEEE Electron Device Kolkata Conference, EDKCON 2018 |
Publisher: | Institute of Electrical and Electronics Engineers Inc. |
Additional Information: | The copyright for this article belongs to the IEEE. |
Keywords: | Electron devices; Etching; Finite element method; Laser Doppler velocimeters; Microactuators; Microoptics; Natural frequencies; Silicon compounds; Sulfur compounds, COMSOL; Fundamental modes; Laser Doppler vibrometers; LDV measurements; Out-of-plane actuation; Release process; Resonant; Thermal actuator, Micromachining |
Department/Centre: | Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering |
Date Deposited: | 03 Aug 2022 06:00 |
Last Modified: | 03 Aug 2022 06:00 |
URI: | https://eprints.iisc.ac.in/id/eprint/75170 |
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