Nagaraja, AM and Gururaja, S and Udayakumar, A (2022) Tensile behavior of ceramic matrix minicomposites with engineered interphases fabricated by chemical vapor infiltration. In: Journal of the European Ceramic Society, 42 (6). pp. 2659-2671.
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Abstract
Ceramic matrix composites (CMCs) exhibit quasi-ductile behavior beyond the initial elastic region driven by a weak fiber-matrix interface that can be further engineered by introducing a finite thickness interphaseleading to enhanced strength and toughness. The current work explores the engineering of interphases in CMCs by a controlled variation of fabrication process parameters. C/BN/SiC minicomposite configurations have been fabricated by chemical vapor infiltration (CVI) with the intent of varying interphase thickness and constituent volume fractions by varying the interphase and matrix infiltration durations. The effect of processing durations on the resulting microstructure, tensile response, and damage mechanisms up to and during ultimate failure of CMC minicomposites have been investigated. The presented results highlight the significant influence of processing duration on the tensile and failure behavior of CMC minicomposites thereby providing an insight into the processing-microstructure-tensile response relationship in CMCs.
Item Type: | Journal Article |
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Publication: | Journal of the European Ceramic Society |
Publisher: | Elsevier Ltd |
Additional Information: | The copyright for this article belongs to the Elsevier Ltd. |
Keywords: | Ceramic materials; Ceramic matrix composites; Chemical vapor deposition; Chemical vapor infiltration; Fabrication; Microstructure, Ceramic matrix; Ceramic-matrix composite; Ceramic-matrix-composites; Chemical vapor infiltration; Chemical Vapour Infiltration; Ductile behavior; Interphase; Minicomposites; Tensile behaviors; Tensile response, Tensile testing |
Department/Centre: | Division of Mechanical Sciences > Aerospace Engineering(Formerly Aeronautical Engineering) |
Date Deposited: | 24 Jun 2022 10:13 |
Last Modified: | 24 Jun 2022 10:13 |
URI: | https://eprints.iisc.ac.in/id/eprint/73622 |
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