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Thermoelectric properties of Si Nanoparticle-Polyaniline composites

Gupta, Sayak Dutta and Krishna, JBM and Ray, Mallar (2017) Thermoelectric properties of Si Nanoparticle-Polyaniline composites. In: 1st International Conference on Electronics, Materials Engineering and Nano-Technology, IEMENTech 2017, 28-29 April 2017, Kolkata, India, pp. 1-4.

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Official URL: https://doi.org/10.1109/IEMENTECH.2017.8076934


The potential of silicon nanoparticle (Si NP)-polyaniline (PANI) composite as next-generation thermoelectric (TE) material has been investigated in this study. Si NPs, prepared by oxidation-etching-oxidation of milled Si powder was mechanically mixed with PANI, synthesized by oxidative polymerization of aniline. The Seebeck coefficient of dedoped PANI and its composite with Si NPs was remarkably high, but the composite behaved like a perfect insulator making it unsuitable as a TE material. However, the incorporation of Si NPs in protonated PANI showed an improvement in Seebeck coefficient by 1μV/K at room temperature without any major decrement in the electrical conductivity. Protonated PANI-Si NP composites hold immense promise as efficient TE.

Item Type: Conference Paper
Publisher: Institute of Electrical and Electronics Engineers Inc.
Additional Information: The Copyright of this article belongs to the Institute of Electrical and Electronics Engineers Inc.
Keywords: Electrical characterization (I-V); Polyaniline (PANI); Seebeck coefficient; Silicon Nanoparticles (Si NPs); Thermoelectric (TE) materials; Characterization; Nanoparticles; Nanotechnology; Polyaniline; Protonation; Seebeck coefficient; Electrical characterization; Electrical conductivity; Oxidative polymerization of aniline; Polyaniline composites; Polyanilines (PAni); Silicon nanoparticles; Thermoelectric material; Thermoelectric properties; Silicon
Department/Centre: Division of Electrical Sciences > Electronic Systems Engineering (Formerly Centre for Electronic Design & Technology)
Date Deposited: 09 Jun 2022 05:12
Last Modified: 09 Jun 2022 05:12
URI: https://eprints.iisc.ac.in/id/eprint/73255

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