Kumar, Praveen (2017) Electromigration in Metallic Materials and Its Role in Whiskering. [Book Chapter]
Full text not available from this repository.Abstract
In this chapter, an overview of electromigration, which is an electric current driven diffusion controlled phenomenon, in solid pure metals, alloys, and liquid metals will be presented, along with the description of fundamental quantitative expressions. Effects of thermomigration-electromigration coupling and electromigration-induced back-stress in solid metal lines on the resultant mass transport will also be discussed. Since electromigration is a diffusion-controlled phenomenon that generates a stress gradient in a conductor, it may affect several stress directed diffusion controlled phenomena, such as whiskering, creep, etc. In this context, a brief introduction of whisker growth, especially in Sn coatings, will be presented. Finally, a correlation between electromigration and whiskering will be explored by using the link between the electromigration driven mass transport, back-stress, and the whiskering mediated relaxation of the generated stress.
| Item Type: | Book Chapter |
|---|---|
| Publisher: | Elsevier Inc. |
| Additional Information: | The copyright for this article belongs to the Elsevier Inc. |
| Keywords: | Back-stress; Cavitation; Electromigration; Stress-relaxation; Whiskering |
| Department/Centre: | Division of Mechanical Sciences > Mechanical Engineering |
| Date Deposited: | 29 May 2022 08:42 |
| Last Modified: | 31 May 2022 00:49 |
| URI: | https://eprints.iisc.ac.in/id/eprint/72798 |
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