A composition-dependent thermal behavior of Si20Te80−xSnx glasses: Observation of Boolchand intermediate phase

K B, J and Tanujit, B and Roy, D and Asokan, S and Das, C (2021) A composition-dependent thermal behavior of Si20Te80−xSnx glasses: Observation of Boolchand intermediate phase. In: Journal of Non-Crystalline Solids, 577 .

	PDF jou_non_cry_sol_2021.pdf - Published Version Restricted to Registered users only Download (1MB) | Request a copy
	Archive (ZIP) ScienceDirect_files_30Dec2021_10-59-17.643.zip - Published Supplemental Material Restricted to Registered users only Download (800kB) | Request a copy

Abstract

Thermal properties have been investigated using alternating differential scanning calorimetry (ADSC) for determining the phase transitions of Si20Te80−xSnx glass samples (1 ≤ x ≤ 6). Experiments are performed to assess the variations of thermal characteristics such as glass transition temperature (Tg) and crystallization temperature (Tc) etc. as a function of Sn variation. The glass-forming ability (GFA) and thermal stability (ΔT) are analyzed for understanding the suitability of as-prepared material in terms of network connectivity and rigidity. The studies have revealed minimum non-reversing enthalpy (ΔHNR) value between compositions (2 ≤ x ≤ 5) of Si20Te80−xSnx glasses, which serve as a basis of the existence of Boolchand's intermediate phase (BIP). It is observed that an increase in Sn dopant resulted in an increase in the density and decrease in the molecular volume of Si20Te80−xSnx samples. These studies reveal the correlation with the memory switching behavior displayed by Si20Te80−xSnx glasses.

Item Type:	Journal Article
Publication:	Journal of Non-Crystalline Solids
Publisher:	Elsevier B.V.
Additional Information:	The copyright for this article belongs to Elsevier B.V
Keywords:	Differential scanning calorimetry; Glass; Glass transition; Rigidity; Silicon; Tin, Boolchand intermediate phase; Crystallization temperature; Glass samples; Glass transition temperature Tg; Glass-forming ability; Intermediate phasis; Network connectivity; Network connectivity and rigidity; Thermal behaviours; Thermal characteristics, Thermodynamic stability
Department/Centre:	Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics
Date Deposited:	31 Dec 2021 07:18
Last Modified:	12 Sep 2022 06:09
URI:	https://eprints.iisc.ac.in/id/eprint/70880

Actions (login required)

View Item