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Microstructure and residual stress evolution in nanocrystalline Cu-Zr thin films

Chakraborty, J and Oellers, T and Raghavan, R and Ludwig, A and Dehm, G (2022) Microstructure and residual stress evolution in nanocrystalline Cu-Zr thin films. In: Journal of Alloys and Compounds, 896 .

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Official URL: https://doi.org/10.1016/j.jallcom.2021.162799


Grazing incidence X-ray diffraction (GIXRD) and scanning transmission electron microscopy (STEM) combined with energy dispersive X-ray spectroscopy (EDS) were employed to study the microstructure evolution and stress development in the nanocrystalline Cu100�X-ZrX (2.5 at � x � 5.5 at) alloy thin films. Small Zr additions to Cu led to significant lattice parameter anisotropy in the as-deposited Cu-Zr thin films both due to macroscopic lattice strain and stacking faults in the Cu matrix. Strain free lattice parameters obtained after the XRD stress analysis of Cu-Zr thin films confirmed formation of a supersaturated substitutional Cu-Zr solid solution. For the first time, the study of film microstructure by XRD line profile analysis (XLPA) confirmed progressive generation of dislocations and planar faults with increasing Zr composition in Cu-Zr alloy films. These microstructural changes led to the generation of tensile stresses in the thin films along with considerable stress gradients across the films thicknesses which are quantified by the traditional d�hkl�Sin2� and GIXRD stress measurement methods. The origin of tensile stresses and stress gradients in the Cu-Zr film are discussed on the basis of film growth and heterogeneous microstructure with changing Zr composition. © 2021

Item Type: Journal Article
Publication: Journal of Alloys and Compounds
Publisher: Elsevier Ltd
Additional Information: The copyright for this article belongs to Elsevier Ltd
Keywords: Binary alloys; Copper alloys; Energy dispersive spectroscopy; Film growth; High resolution transmission electron microscopy; Lattice constants; Microstructure; Nanocrystals; Scanning electron microscopy; Stress analysis; Tensile stress; Thin films; X ray diffraction; Zircaloy, Cu-zr; Grazing incidence X-ray diffraction; Grazing-incidence X-ray diffraction; Nanocrystalline Cu; Stress evolution; Stress gradient; Thin-films; X ray scanning; X- ray diffractions; XRD, Residual stresses
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 06 Jan 2022 06:14
Last Modified: 06 Jan 2022 06:14
URI: http://eprints.iisc.ac.in/id/eprint/70792

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