Nittala, PVK and Sen, P and Bhat, KN and Nayak, MM Patrikar, Rajendra M, ed (2020) 3D packaging for the integration of heterogeneous systems. Institution of Engineering and Technology, pp. 323-370.
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Official URL: https://doi.org/10.1049/PBCS065E_ch10
Abstract
This paper discusses innovative processing technologies that would allow 3D packaging by the post-fab vertical stacking technique, suitable for the packaging industry. These novel simple processes may pave way towards 3D-stacked ultra-thin devices. © The Institution of Engineering and Technology 2020.
| Item Type: | Book |
|---|---|
| Publication: | MEMS Resonator Filters |
| Publisher: | Institution of Engineering and Technology |
| Additional Information: | The copyright for this article belongs to IET. |
| Department/Centre: | Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering |
| Date Deposited: | 26 Oct 2021 05:57 |
| Last Modified: | 26 Oct 2021 05:57 |
| URI: | http://eprints.iisc.ac.in/id/eprint/70324 |
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