Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies

Nittala, PVK and Haridas, K and Nigam, S and Tasneem, S and Sen, P (2021) Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies. In: Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics, 39 (5).

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Abstract

This paper presents the process flow optimizations for the 3D stacking of thin silicon dies. This process is developed for the postfabrication 3D integration technique, which can be used by 3D packaging and heterogenous or hybrid integration fabs. Bonding of the thin silicon layers is optimized by reducing the epoxy thickness. Further, a detailed of set experiments were used to characterize the stress in the thin silicon films. Finally, a hybrid process flow is demonstrated for achieving finer interconnect linewidths of 10 μm. The 3D stacking approach is based on the bonding of thin dies followed by SU-8 planarization. Vias are opened in the planarization layer using lithography. The interconnection methodology fills the SU-8 polymer vias with inkjet-printed silver. Printing the interconnect lines using the standard inkjet printer limits the linewidth to �100 μm. To address this, a hybrid process is developed to scale the interconnect line widths. Along with interconnects in the multilayer stack, we demonstrate a minimum line width and spacing of 10 μm and a via diameter of 10 μm. © 2021 Author(s).

Item Type:	Journal Article
Publication:	Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics
Publisher:	AVS Science and Technology Society
Additional Information:	The copyright for this article belongs to AVS Science and Technology Society
Keywords:	Ink jet printers; Printing presses, Hybrid integration; Interconnect lines; Interconnect technology; Multilayer stacks; Planarization layers; Post-fabrication; Thin silicon films; Thin silicon layers, Three dimensional integrated circuits
Department/Centre:	Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited:	02 Dec 2021 12:57
Last Modified:	02 Dec 2021 12:57
URI:	http://eprints.iisc.ac.in/id/eprint/70074

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