Shrivastava, M and Ramgopal Rao, V (2021) A Roadmap for Disruptive Applications and Heterogeneous Integration Using Two-Dimensional Materials: State-of-the-Art and Technological Challenges. In: Nano Letters .
PDF
nl1c00729_si_001.pdf - Published Supplemental Material Restricted to Registered users only Download (135kB) | Request a copy |
|
PDF
nan_let_21-15_6359-6381_2021.pdf - Published Version Restricted to Registered users only Download (6MB) | Request a copy |
Abstract
This Mini Review attempts to establish a roadmap for two-dimensional (2D) material-based microelectronic technologies for future/disruptive applications with a vision for the semiconductor industry to enable a universal technology platform for heterogeneous integration. The heterogeneous integration would involve integrating orthogonal capabilities, such as different forms of computing (classical, neuromorphic, and quantum), all forms of sensing, digital and analog memories, energy harvesting, and so forth, all in a single chip using a universal technology platform. We have reviewed the state-of-the-art 2D materials such as graphene, transition metal dichalcogenides, phosphorene and hexagonal boron nitride, and so forth, and how they offer unique possibilities for a range of futuristic/disruptive applications. Besides, we have discussed the technological and fundamental challenges in enabling such a universal technology platform, where the world stands today, and what gaps are required to be filled. © 2021 American Chemical Society. All rights reserved.
Item Type: | Journal Article |
---|---|
Publication: | Nano Letters |
Publisher: | American Chemical Society |
Additional Information: | The copyright for this article belongs to American Chemical Society |
Keywords: | Energy harvesting; III-V semiconductors; Microelectronics; Semiconductor device manufacture; Transition metals, Heterogeneous integration; Hexagonal boron nitride; Microelectronic technologies; Semiconductor industry; Technological challenges; Transition metal dichalcogenides; Two Dimensional (2 D); Two-dimensional materials, Integration |
Department/Centre: | Division of Electrical Sciences > Electronic Systems Engineering (Formerly Centre for Electronic Design & Technology) |
Date Deposited: | 21 Nov 2021 16:26 |
Last Modified: | 21 Nov 2021 16:26 |
URI: | http://eprints.iisc.ac.in/id/eprint/69917 |
Actions (login required)
View Item |