Langoju, LRR and Singha, MK and Subramaniam, KM and Asokan, S (2021) Optimization of low resistivity molybdenum thin films for high-temperature microheater applications. In: Superlattices and Microstructures, 156 .
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Abstract
In this paper, we discuss the optimal DC magnetron sputtering deposition conditions needed to obtain low resistivity Molybdenum (Mo) thin films for high-temperature (800 °C) microheater applications. The influence of Ar gas pressure (2�10 mTorr), sputtering power (80�160 W), and annealing temperature (200�1000 °C) on the resistivity and adhesive properties of Mo thin films were investigated. The structural, morphological, and electrical properties of as-deposited and annealed Mo thin films were characterized by X-ray diffraction, Scanning Electron Microscopy, Atomic Force Microscopy, and four-point probe techniques. The thin films deposited at 120 W, 6 mTorr, and annealed at 1000 °C showed low resistivity (18 μΩ-cm) and good adhesive properties. Suspended-membrane microheaters were fabricated using as-deposited and annealed Mo thin films, and their performance characteristics were compared. The impact of thin-film resistivity on power consumption and on the maximum operating temperature of Mo microheater was also investigated. © 2021 Elsevier Ltd
Item Type: | Journal Article |
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Publication: | Superlattices and Microstructures |
Publisher: | Academic Press |
Additional Information: | The copyright for this article belongs to Academic Press |
Keywords: | Adhesion; Adhesives; Annealing; High temperature applications; Magnetron sputtering; MEMS; Microelectromechanical devices; Molybdenum; Scanning electron microscopy, Adhesive properties; DC magnetra sputtering; Highest temperature; Low resistivity; Magnetron-sputtering deposition; Microheater; Molybdenum thin film; Optimisations; Resistivity; Thin-films, Thin films |
Department/Centre: | Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics |
Date Deposited: | 15 Nov 2021 10:36 |
Last Modified: | 15 Nov 2021 10:36 |
URI: | http://eprints.iisc.ac.in/id/eprint/69657 |
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