Pandit, JK and Roy Mahapatra, D and Trikha, M (2020) Estimation of dynamic stresses in connecting leads of SMC on PCB for launch loads. In: 71st International Astronautical Congress, IAC 2020, 12-14 Oct-2020.
Full text not available from this repository.Abstract
The electronic assemblies in spacecraft are subjected to quite high vibration loads during the launch phase. The success of the spacecraft mission entirely depends on the safety of these electronics during the ascend phase which ensures their proper functioning in on-orbit conditions. In order to provide high reliable and cost effective electronic packages, system designers should have better understanding of the loads coming on to the printed circuit board and the surface mounted components, mounted on it. © 2020 by the International Astronautical Federation (IAF). All rights reserved.
| Item Type: | Conference Paper |
|---|---|
| Publication: | Proceedings of the International Astronautical Congress, IAC |
| Publisher: | International Astronautical Federation, IAF |
| Additional Information: | The copyright of this article belongs to International Astronautical Federation, IAF |
| Keywords: | Cost effectiveness; Orbits, Cost effective; Dynamic stress; Electronic assemblies; Electronic package; Spacecraft missions; Surface-mounted; System designers; Vibration loads, Printed circuit boards |
| Department/Centre: | Division of Mechanical Sciences > Aerospace Engineering(Formerly Aeronautical Engineering) |
| Date Deposited: | 31 May 2021 05:55 |
| Last Modified: | 31 May 2021 05:55 |
| URI: | http://eprints.iisc.ac.in/id/eprint/68248 |
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