Vasudha, N and Uma Rao, K (2020) Shape memory alloy properties, modelling aspects and potential applications - A review. In: Journal of Physics: Conference Series, 13-14 August 2020, Virtual; India.
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Abstract
Shape Memory Alloys (SMAs) are an interesting class of materials for researchers over the past few decades. With the advancement in material science and technology, more importance is given to active materials whose properties can be tailored according to the needs, enabling the development of engineered materials that are strong, lighter in weight, and occupy less volume. The shape memory alloys stand apart from the other metals in terms of the recoverable strain it can undergo upon excitation by a thermal stimulus. Due to this unique nature the SMAs possess dual functionality, wherein it poses both as a sensor as well as an actuator, and hence finds its applications in diverse fields. The current paper will give a brief introduction to the SMA and its key effects, review and discuss the different types of SMAs, their material characteristics, behavior, advantages, modeling aspects that will aid in the practical implementation of the SMAs and potential applications. © Published under licence by IOP Publishing Ltd.
| Item Type: | Conference Paper |
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| Publication: | Journal of Physics: Conference Series |
| Publisher: | IOP Publishing Ltd |
| Additional Information: | cited By 0; Conference of 1st International Conference on Advances in Physical Sciences and Materials 2020, ICAPSM 2020 ; Conference Date: 13 August 2020 Through 14 August 2020; Conference Code:165967 |
| Keywords: | Physics, Active material; Engineered materials; ITS applications; Material characteristics; Material science; Modeling aspects; Recoverable strain; Thermal stimuli, Shape-memory alloy |
| Department/Centre: | Division of Electrical Sciences > Electronic Systems Engineering (Formerly Centre for Electronic Design & Technology) |
| Date Deposited: | 15 Jan 2021 10:50 |
| Last Modified: | 15 Jan 2021 10:50 |
| URI: | http://eprints.iisc.ac.in/id/eprint/67602 |
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