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Influence of heat treatment on microstructure and mechanical behaviour of hot-rolled Al-Mg-Si alloy

Kumar, RV and Keshavamurthy, R and Perugu, CS and Siddaraju, C (2020) Influence of heat treatment on microstructure and mechanical behaviour of hot-rolled Al-Mg-Si alloy. In: Advances in Materials and Processing Technologies .

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Official URL: https://dx.doi.org/10.1080/2374068X.2020.1796463

Abstract

As cast Al-Mg-Si alloy was hot-rolled at a temperature of 400°C. After rolling, the alloy was subjected to T6 heat treatment by solutionising at 530°C for 2 hours followed by quenching in water media. Heat-treated rolled Al-Mg-Si alloy was subjected to microstructural studies, microhardness test and tensile properties (In rolling direction, 45° and 90° to rolling direction). It is observed that heat treatment of rolled Al-Mg-Si alloy increases microhardness up to a certain duration of ageing and further drops to lower hardness. On heat treatment, the rolled alloy exhibited maximum tensile strength in rolling direction in comparison with 45°and 90°directions to rolling. It is observed that hot rolling followed by T6 heat treatment of Al-Mg-Si alloy tends to impart higher tensile strength compared to previously reported experimental values or commercially available alloys for developing high strength lightweight material. Under peak-aged condition, yield strength of 410 MPa and UTS of 440 MPa was achieved in the present work which is significantly higher than values reported in previous works. © 2020 Informa UK Limited, trading as Taylor & Francis Group.

Item Type: Journal Article
Publication: Advances in Materials and Processing Technologies
Publisher: Taylor and Francis Ltd.
Additional Information: Copy right for this article belongs to Taylor and Francis Ltd.
Keywords: Al-Mg-Si alloy; mechanical properties; hot Rolling; heat Treatment
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 27 Nov 2020 06:27
Last Modified: 27 Nov 2020 06:27
URI: http://eprints.iisc.ac.in/id/eprint/66271

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