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Numerical studies on weak bond effects in single and dual adhesive bonded single lap joint between CFRP and aluminium

Jairaja, R and Naik, GN (2020) Numerical studies on weak bond effects in single and dual adhesive bonded single lap joint between CFRP and aluminium. In: 6th International Conference on Recent Advances in Composite Materials, ICRACM 2019, 25 February 2019, Varanasi, pp. 1064-1068.

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Official URL: https://dx.doi.org/10.1016/j.matpr.2020.01.006

Abstract

In this paper, Araldite-2015 and AV138 adhesives are used individually, Araldite-2015 ductile adhesive has been used in single adhesive bonded joint between Carbon Fiber Reinforced Plastics (CFRP) and aluminium. Then Araldite-2015 ductile and AV138 brittle adhesives are used together as separate portions in the bonded region in dual adhesive bonded joints. Different weak bonds are introduced in single and dual adhesive bonded joints. The tensile loads have been applied at the free end of the adherends to find the bond strength of the adhesives. Variations of peel and shear stresses have been captured along the single and dual adhesive bonded joints with varied areas of the weak bond. This numerical study is useful for preliminary research and also reduces time and cost involved to conduct the experimental work. From the studies, it is found that the bond strength decreases with increase in the weak bond area. The weak bond effects in dual adhesive bonded joints are not significant when compared to single adhesive bonded joints. © 2019 Elsevier Ltd. All rights reserved.

Item Type: Conference Paper
Publication: Materials Today: Proceedings
Publisher: Elsevier Ltd
Additional Information: cited By 0; Conference of 6th International Conference on Recent Advances in Composite Materials, ICRACM 2019 ; Conference Date: 25 February 2019 Through 28 February 2019; Conference Code:157883
Department/Centre: Division of Mechanical Sciences > Aerospace Engineering(Formerly Aeronautical Engineering)
Date Deposited: 17 Aug 2020 11:05
Last Modified: 17 Aug 2020 11:05
URI: http://eprints.iisc.ac.in/id/eprint/64987

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