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Coupling the High-Throughput Property Map to Machine Learning for Predicting Lattice Thermal Conductivity

Juneja, Rinkle and Yumnam, George and Satsangi, Swanti and Singh, Abhishek K (2019) Coupling the High-Throughput Property Map to Machine Learning for Predicting Lattice Thermal Conductivity. In: CHEMISTRY OF MATERIALS, 31 (14). pp. 5145-5151.

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Official URL: http://dx.doi.org/10.1021/acs.chemmater.9b01046


Low thermal conductivity materials are crucial for applications such as thermoelectric conversion of waste heat to useful energy and thermal barrier coatings. On the other hand, high thermal conductivity materials are necessary for cooling electronic devices. However, search for such materials via explicit evaluation of thermal conductivity either experimentally or computationally is very challenging. Here, we carried out high-throughput ab initio calculations, on a dataset containing 195 binary, ternary, and quaternary. compounds. The lattice thermal conductivity kappa(l) values of 120 dynamically stable and nonmetallic compounds are calculated, which span over 3 orders of magnitude. Among these, 11 ultrahigh and 15 ultralow kappa(l) materials are identified. An analysis of generated property map of this dataset reveals a strong dependence of kappa(l) on simple descriptors, namely, maximum phonon frequency, integrated Griineisen parameter up to 3 THz, average atomic mass, and volume of the unit cell. Using these descriptors, a Gaussian process regression-based machine learning (ML) model is developed. The model predicts log-scaled xi with a very small root mean square error of similar to 0.21. Comparatively, the Slack model, which uses more involved parameters, severely overestimates kappa(l). The superior performance of our ML model can ensure a reliable and accelerated search for multitude of low and high thermal conductivity materials.

Item Type: Journal Article
Additional Information: Copyright of this article belongs to AMER CHEMICAL SOC
Department/Centre: Division of Chemical Sciences > Materials Research Centre
Date Deposited: 18 Nov 2019 11:46
Last Modified: 18 Nov 2019 11:46
URI: http://eprints.iisc.ac.in/id/eprint/63408

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