Creep of Cu-Bi Alloys with High Bi Content Near and Above Melting Temperature of Bi

Singh, Shobhit P and Sonawane, Dipali and Kumar, Praveen (2019) Creep of Cu-Bi Alloys with High Bi Content Near and Above Melting Temperature of Bi. In: METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 50A (6). pp. 2690-2701.

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Abstract

Cu-Bi alloy with high Bi content can be used for thermal surge protection and energy storage. For these applications, creep at high temperatures, including temperatures above the melting temperature of Bi, T-m,T-Bi, becomes important. Accordingly, the creep behavior of Cu-Bi alloys, comprising 30 and 40 vol pct Bi, was studied under compression at temperatures above and below T-m,T-Bi. At 200 degrees C, which is below T-m,T-Bi, Cu-Bi showed a stress exponent of similar to 4 at high stresses and similar to 1 at low stresses. Finite element analysis revealed that the creep behavior of Cu-Bi at 200 degrees C was predominantly governed by Bi. On the other hand, at temperatures higher than T-m,T-Bi, Cu-Bi showed a short transient stage at high stresses, followed by sudden failure of the material. However, at low stresses, the sample first continued to expand and then started to accumulate compressive strain. A qualitative model based on interaction between liquid Bi and Cu is developed to explain the observed creep behavior at temperatures higher than T-m,T-Bi. The results obtained here shed light on the creep behavior of alloys with constituents having significantly different creep behavior and containing a non-reacting liquid phase. (C) The Minerals, Metals & Materials Society and ASM International 2019

Item Type:	Journal Article
Publication:	METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
Publisher:	SPRINGER
Additional Information:	Copyright of this article belongs to Springer
Department/Centre:	Division of Chemical Sciences > Materials Research Centre
Date Deposited:	24 May 2019 11:53
Last Modified:	24 May 2019 11:53
URI:	http://eprints.iisc.ac.in/id/eprint/62715

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