Meng, Xianghai and Pandey, Tribhuwan and Jeong, Jihoon and Fu, Suyu and Yang, Jing and Chen, Ke and Singh, Akash and He, Feng and Xu, Xiaochuan and Zhou, Jianshi and Hsieh, Wen-Pin and Singh, Abhishek K and Lin, Jung-Fu and Wang, Yaguo (2019) Thermal Conductivity Enhancement in MoS2 under Extreme Strain. In: PHYSICAL REVIEW LETTERS, 122 (15).
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Abstract
Because of their weak interlayer bonding, van der Waals (vdW) solids are very sensitive to external stimuli such as strain. Experimental studies of strain tuning of thermal properties in vdW solids have not yet been reported. Under similar to 9% cross-plane compressive strain created by hydrostatic pressure in a diamond anvil cell, we observed an increase of cross-plane thermal conductivity in bulk MoS2 from 3.5 to about 25 W m(-1) K-1, measured with a picosecond transient thermoreflectance technique. First-principles calculations and coherent phonon spectroscopy experiments reveal that this drastic change arises from the strain-enhanced interlayer interaction, heavily modified phonon dispersions, and decrease in phonon lifetimes due to the unbundling effect along the cross-plane direction. The contribution from the change of electronic thermal conductivity is negligible. Our results suggest possible parallel tuning of structural, thermal, and electrical properties of vdW solids with strain in multiphysics devices.
| Item Type: | Journal Article |
|---|---|
| Publication: | PHYSICAL REVIEW LETTERS |
| Publisher: | AMER PHYSICAL SOC |
| Additional Information: | The copyright for this article belongs to the Authors. |
| Department/Centre: | Division of Chemical Sciences > Materials Research Centre |
| Date Deposited: | 17 May 2019 06:44 |
| Last Modified: | 19 Oct 2022 08:19 |
| URI: | https://eprints.iisc.ac.in/id/eprint/62661 |
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