Effects of Cu and In Trace Elements on Microstructure and Thermal and Mechanical Properties of Sn-Zn Eutectic Alloy

Pandey, P and Tiwary, CS and Chattopadhyay, K (2018) Effects of Cu and In Trace Elements on Microstructure and Thermal and Mechanical Properties of Sn-Zn Eutectic Alloy. In: JOURNAL OF ELECTRONIC MATERIALS, 48 (5). pp. 2660-2669. (In Press)

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Abstract

The effects of addition of small amounts of copper (Cu) and indium (In) on the microstructure and thermal and mechanical properties of Sn-Zn eutectic alloy have been investigated. Cu and In were added in varying amounts to Sn-14.9at.%Zn alloy by replacing an equal amount of Sn. Addition of Cu changed the eutectic composition, leading to the appearance of primary phases followed by the formation of intermetallic compounds (IMC) CuZn5 and Cu5Zn8. However, addition of indium (In) did not lead to formation of any new IMCs. With addition of Cu or In to the binary eutectic, the eutectic microstructure coarsened (the eutectic spacing increased). Addition of 1.919at.% indium decreased the Sn-Zn eutectic temperature from 198.8 degrees C to 192.0 degrees C. On the other hand, addition of Cu did not affect the eutectic temperature as much as In addition did. The mushy (or pasty) range (the temperature range between the eutectic temperature and the melting temperature of the primary phase) increased with addition of Cu or In. Addition of a small amount of copper increased the yield strength of the binary eutectic alloy. The maximum hardness and yield strength of 24 +/- 2HV and 60 +/- 3MPa, respectively, were found with addition of 0.841at.% Cu; this improvement in strength can be attributed to formation of hard IMCs. In contrast, addition of a small amount of In initially decreased the strength, but the strength increased to 50 MPa at 1.919at.% In. This can be attributed to the effect of solid-solution strengthening due to the In solute in soft beta-Sn.

Item Type:	Journal Article
Publication:	JOURNAL OF ELECTRONIC MATERIALS
Publisher:	SPRINGER
Additional Information:	The copyright for this article belongs to Springer New York LLC
Keywords:	Lead-free Sn-Zn solder; IMC; eutectic spacing; eutectic temperature; pasty range; mechanical properties
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	11 May 2019 06:43
Last Modified:	11 May 2019 06:43
URI:	http://eprints.iisc.ac.in/id/eprint/62531

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