Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board

Yamaguchi, Masahiro and Yanai, Takeshi and Nakayama, Hidetoshi and Sai, Ranajit and Fujiwara, Hiroaki and Kitai, Yuki and Sato, Mikio and Sangawa, Ushio (2018) Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board. In: IEEE TRANSACTIONS ON MAGNETICS, 54 (11).

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Abstract

Application of negative permeability beyond ferromagnetic resonance frequency is discussed in this paper. Targeted application is the skin effect suppression technology for long wiring on high-speed and low-delay I/O board. An 11.9 mu m-thick Ni-Fe/Cu multilayer consisting of 0.25 mu m-thick Ni-Fe and 0.51 mu m-thick Cu in turn was electroplated, patterned into 609 mu m-wide and 40 mm-long signal line of microstrip line (MSL) on a 250 mu m-thick printed circuit board. Targeted frequency was 15 GHz, where relative real part permeability was supposed to be -2. The 40 mm-long Ni-Fe/Cu multilayer exhibited the insertion as small as 0.7 dB up to 25 GHz, which is almost the same as the copper monolayer MSL of the same geometry.

Item Type:	Journal Article
Publication:	IEEE TRANSACTIONS ON MAGNETICS
Publisher:	IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Additional Information:	Copy right for this article belong to IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords:	Electroplated multilayer; I/O interface board; Ni-Fe; skin effect suppression
Department/Centre:	Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited:	12 Nov 2018 15:42
Last Modified:	12 Nov 2018 15:42
URI:	http://eprints.iisc.ac.in/id/eprint/61022

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