Sharma, Deepak and Jain, Aman and Somaiah, Nalla and Narayanan, P Ramesh and Kumar, Praveen (2018) Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material. In: JOURNAL OF ELECTRONIC MATERIALS, 47 (8). pp. 4863-4874.
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Abstract
The effect of embedding Cu-graphene hybrid powder, namely ``graphene nano-sheet Cu'' (GNS-Cu) powder, into In-40 vol.% Cu solder alloy on the electrical and mechanical properties of In-Cu solder is investigated. GNS-Cu hybrid powders were prepared by mixing reduced graphene oxide powders and CuSO4 center dot 5H(2)O, followed by reduction of the mixture with hydrazine. Subsequently, In-Cu solders with GNS-Cu powders were prepared using a 2-step process, comprising liquid phase sintering (LPS) of In and Cu powders followed by accumulative roll bonding (ARB). During ARB, the GNS-Cu powders were embedded as distinct layers into In-Cu composite solders. Electrical conductivity of the GNS-Cu embedded solders increased by > 20% as compared to pure In-Cu solders processed through the same combination of LPS-ARB steps. The yield strength of In-Cu solder increased by only 10% with the addition of GNS-Cu powders and thus retained the moderate strength often associated with pure In-Cu composite solders. Moreover, the thermal conductivity of GNS-Cu-embedded solders was estimated theoretically to increase by > 60%. These promising findings suggest that GNS-Cu-embedded In-Cu solders can be suitable for next-generation metallic thermal interface material and package-level interconnect applications.
Item Type: | Journal Article |
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Publication: | JOURNAL OF ELECTRONIC MATERIALS |
Publisher: | SPRINGER, 233 SPRING ST, NEW YORK, NY 10013 USA |
Additional Information: | Copyright of this article belong to SPRINGER, 233 SPRING ST, NEW YORK, NY 10013 USA |
Department/Centre: | Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy) |
Date Deposited: | 23 Jul 2018 15:41 |
Last Modified: | 23 Jul 2018 15:41 |
URI: | http://eprints.iisc.ac.in/id/eprint/60273 |
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