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Graphene-Nickel Composite Films on Flexible PCB for Temperature Monitoring

Kedambaimoole, Vaishakh and Neella, Nagarjuna and Gaddam, Venkateswarlu and Rajanna, K and Nayak, M M (2017) Graphene-Nickel Composite Films on Flexible PCB for Temperature Monitoring. In: 12th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems (IEEE-NEMS), APR 09-12, 2017, Los Angeles, CA, pp. 173-176.

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Official URL: http://dx.doi.org/ 10.1109/NEMS.2017.8016999


This paper presents a novel method to fabricate temperature sensor arrays by screen printing Graphene - Nickel (Ni) nanocomposite film on flexible printed circuit board (PCB). Screen printing is a cost effective fabrication technique to get uniform thickness film on a substrate. The fabricated temperature sensor array, each having sensing thickness of around 50 mu m is studied for the temperature response. The synthesized RGO nanosheets and RGO-Ni nanocomposite were characterized by XRD and FE-SEM for structural and compositional analysis. Temperature variation is measured in terms of change in resistance. It is observed that resistance decreases with the increase in temperature showing NTC (Negative Temperature Coefficient) behavior. The calculated response of the sensor in terms of sensitivity is around 2.455 Omega / K and temperature coefficient of resistance (TCR) is around 2.635 x10(-3) Omega / Omega / K. Our approach shows a very simple fabrication process for making mass production of sensors on PCB that can be easily integrated with electronic devices and as a wearable body temperature sensor.

Item Type: Conference Proceedings
Publisher: IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Additional Information: Copy right for the article belong to IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Department/Centre: Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics
Date Deposited: 14 Mar 2018 17:36
Last Modified: 14 Mar 2018 17:36
URI: http://eprints.iisc.ac.in/id/eprint/59192

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