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Mesh Interpolated Krylov Recycling Method to Expedite 3-D Full-Wave MoM Solution for Design Variants

Chatterjee, Gourav and Das, Arkaprovo and Vedicherla, Sreenivasulu Reddy and Gope, Dipanjan (2017) Mesh Interpolated Krylov Recycling Method to Expedite 3-D Full-Wave MoM Solution for Design Variants. In: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 65 (9). pp. 3159-3171.

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Official URL: http://doi.org/10.1109/TMTT.2017.2682059

Abstract

Today's 3-D full-wave electromagnetic (EM) solvers follow the conventional model-mesh-solve workflow to analyze any EM structure. These solvers treat each model independently regardless of any similarity with a previously solved model and, therefore, sacrifice the possibility of accelerating a model solution from information harnessed from a prior solution of a similar model. This is a missed opportunity particularly in the solution of design variants, which involve multiple models with near-identical geometrical features. A Krylov recycling (KR) technique has been proposed in the past for the incremental solution of electrostatic problems. However, the technique is limited by the requirement of an unchanged mesh for the unmodified section of the model, which is difficult to achieve for a conformal mesh of a practical geometry. In this paper, a mesh-interpolated Krylov recycling (MIKR) technique is proposed to expedite the solution of 3-D full-wave surface-volume electric field integral equation-based system by reusing the Krylov subspace from the base design. The mesh interpolation mechanism is proposed to be able to handle mesh changes in the unmodified section of the model. The method is independent of the choice of fast solver compression methodology and the preconditioning strategy, and can be applied in unison with them. Numerical results demonstrate up to 5x speedup in convergence over a cutting-edge preconditioned linear complexity fast solver methodology.

Item Type: Journal Article
Publication: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Additional Information: Copy right for this article belongs to the IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, NJ 08855-4141 USA
Department/Centre: Division of Electrical Sciences > Electrical Communication Engineering
Date Deposited: 30 Sep 2017 09:20
Last Modified: 30 Sep 2017 09:20
URI: http://eprints.iisc.ac.in/id/eprint/57937

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