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Feasibility of Single Wire Communication for PCB-level Interconnects

Kotethota, Skanda and Hada, Gaurav and Ramaswamy, Parthasarathy and Gope, Dipanjan (2017) Feasibility of Single Wire Communication for PCB-level Interconnects. In: 21st IEEE Workshop on Signal and Power Integrity (SPI), MAY 07-10, 2017, Baveno, ITALY.

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Official URL: http://dx.doi.org/10.1109/SaPIW.2017.7944041


In this paper, the applicability of Single Wire Communication (SWC) is explored for Printed Circuit Board (PCB) interconnects. Traditionally quasi-TEM mode based multi-conductor transmission lines like microstrip or stripline configurations have been employed for PCB applications with a ground plane for current return. At high frequencies, approaching 50GHz and more, the insertion profile of quasi-TEM transmission suffers primarily due to dielectric loss. On the other hand, due to TM mode of propagation SWC presents a viable low-loss communication alternative at such high frequencies. In this work, some of the challenges of practical implementation for SWC, including planar launchers and mitigating cross-talk effects, are studied and the relative advantages over microstrip transmission is demonstrated.

Item Type: Conference Proceedings
Series.: IEEE Workshop on Signal and Power Integrity
Additional Information: Copy right for this article belongs to the IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Department/Centre: Division of Electrical Sciences > Electrical Communication Engineering
Date Deposited: 22 Jul 2017 07:05
Last Modified: 22 Jul 2017 07:05
URI: http://eprints.iisc.ac.in/id/eprint/57478

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