ePrints@IIScePrints@IISc Home | About | Browse | Latest Additions | Advanced Search | Contact | Help

Mesh-based Impedance Sensitivity Formulation for DC/AC Power Integrity Design and Diagnosis

Ambasana, Nikita and Nayak, Bibhu Prasad and Gope, Dipanjan (2017) Mesh-based Impedance Sensitivity Formulation for DC/AC Power Integrity Design and Diagnosis. In: 25th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), OCT 23-26, 2016, San Diego, CA, pp. 53-55.

[img] PDF
2016_Iee_25th_Com_Ele_Per_Ele_Pac_Sys_53.pdf - Published Version
Restricted to Registered users only

Download (1MB) | Request a copy
Official URL: http://dx.doi.org/10.1109/EPEPS.2016.7835416

Abstract

Accurate Power Distribution Network (PDN) design is crucial for Signal/Power Integrity (SI/PI) and Electromagnetic Interference (EMI) compliance. Achieving target power-ground (PG) noise levels for low power complex PDNs requires several design and analysis cycles. Although several classes of analysis tools, 2.5D and 3D, are commercially available, the presence of design tools are limited e. g. parametric design space exploration using multiple forward analysis. In this work, a frequency domain mesh-based sensitivity formulation for DC and AC impedance of PDNs is proposed. The two main objectives include: (i) highlighting layout regions to the designer for maximum impact in achieving target specifications and (ii) predicting the results of a design variant with mesh-based sensitivity information from the base-design. The time required for updating the results for the design variant is negligible compared to a complete re-simulation.

Item Type: Conference Proceedings
Series.: IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS
Publisher: IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Additional Information: 25th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Diego, CA, OCT 23-26, 2016
Department/Centre: Division of Electrical Sciences > Electrical Communication Engineering
Date Deposited: 17 Jun 2017 04:11
Last Modified: 17 Jun 2017 04:11
URI: http://eprints.iisc.ac.in/id/eprint/57243

Actions (login required)

View Item View Item