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Fabrication of Stress-Free MEMS Structures with a Modified SOI-on-Glass

Reddy, Jayaprakash and Pratap, Rudra (2016) Fabrication of Stress-Free MEMS Structures with a Modified SOI-on-Glass. In: 15th IEEE Sensors Conference, OCT 30-NOV 03, 2016, Orlando, FL.

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Official URL: http://dx.doi.org/10.1109/ICSENS.2016.7808653


We report the successful implementation of a modified SOI-on-Glass fabrication process that greatly facilitates realization of stress-free MEMS structures suspended over small gaps, especially useful for capacitive transduction. The key modification is in patterning the capacitive gap in the SOI and patterning the structural layer before bonding the SOI to glass wafer. We demonstrate the process by realizing a doubly clamped beam, an accelerometer, a capacitive micromachined ultrasound transducer, and a Coriolis vibratory gyroscope structure. These MEMS structures are characterized for their stiffness and dynamic response. The experimental results are compared with FEM simulation for frequency response and stiffness. It is observed that the values are in close agreement with simulated results for stress-free structures errors less than 4%, demonstrating that the modified process flow indeed results in stress-free MEMS structures.

Item Type: Conference Proceedings
Series.: IEEE Sensors
Publisher: IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Additional Information: Copy right for this article belongs to the IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Department/Centre: Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited: 20 May 2017 07:28
Last Modified: 20 May 2017 07:28
URI: http://eprints.iisc.ac.in/id/eprint/56976

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