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Electrodeposition of delta-phase based Cu-Sn mirror alloy from sulfate-aqueous electrolyte for solar reflector application

Alex, Sherine and Basu, Bikramjit and Sengupta, Sanchita and Pandey, Upendra K and Chattopadhyay, Kamanio (2016) Electrodeposition of delta-phase based Cu-Sn mirror alloy from sulfate-aqueous electrolyte for solar reflector application. In: APPLIED THERMAL ENGINEERING, 109 (B). pp. 1003-1010.

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Official URL: http://dx.doi.org/10.1016/j.applthermaleng.2016.04...

Abstract

Copper-tin (Cu-Sn) intermetallic alloy coating was developed on mild steel substrate by galvanostatic electrodeposition technique from sulfate-based acidic electrolyte containing Laprol as additive. The homogenous coating containing cubic 8 phase with composition of 32.6% Sn was obtained, when a current of -8.5 mA was made to flow through the electrochemical bath. The optimized coating with thickness of similar to 0.4-3 tm exhibits similar to 80% specular reflectance. The coating has a hardness of 2.6 GPa, suggesting a good scratch resistance property. The experimental results also suggest that the hydrophobic surface of Cu-32.6% Sn thin film can be potentially used as an attractive coating for solar reflector application under dusty and humid conditions. (C) 2016 Published by Elsevier Ltd.

Item Type: Journal Article
Publication: APPLIED THERMAL ENGINEERING
Publisher: PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD OX5 1GB, ENGLAND
Additional Information: Copy right for this article belongs to the PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD OX5 1GB, ENGLAND
Department/Centre: Division of Chemical Sciences > Materials Research Centre
Division of Interdisciplinary Sciences > Interdisciplinary Centre for Energy Research
Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited: 07 Jan 2017 09:55
Last Modified: 06 Oct 2018 13:37
URI: http://eprints.iisc.ac.in/id/eprint/55883

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