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Design Simulation and Fabrication of 3D Electrode for Dielectrophoretic Chip

Singha, Monoj Kumar and Nagaraju, Jampana (2015) Design Simulation and Fabrication of 3D Electrode for Dielectrophoretic Chip. In: 2nd International Symposium on Physics and Technology of Sensors, MAR 08-10, 2015, Pune, INDIA, pp. 192-195.

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Official URL: http://dx.doi.org/10.1109/ISPTS.2015.7220110


This paper presents the design, simulation and fabrication of dielectrophoretic chip with integrated nickel 3D electrodes for bioparticle separation. Finite element analysis software COMSOL Multyphysics 4.3 is used to measure the electric field distribution and also the temperature profile inside the microfluidic channel. The temperature rise is found to be 0.5 K. Electric field distribution shows almost uniform electric field on XY plane at different Z axis. Fabrication of 3D nickel electrode is accomplished using electroplating process. 3D sidewall dielectrophoretic chip reduces the electrochemical effect and joule heating effect.

Item Type: Conference Proceedings
Additional Information: Copy right for this article belongs to the IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Department/Centre: Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics
Date Deposited: 08 Oct 2016 05:49
Last Modified: 08 Oct 2016 05:49
URI: http://eprints.iisc.ac.in/id/eprint/54736

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