Processing and mechanical behavior of Cu-Bi alloys with high volume fraction of Bi: Suitability for high temperature soldering application

Barman, Binay Kumar Deb and Singh, Shobhit Pratap and Kumar, Praveen (2016) Processing and mechanical behavior of Cu-Bi alloys with high volume fraction of Bi: Suitability for high temperature soldering application. In: MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 666 . pp. 339-349.

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Abstract

This work evaluates potential of Cu-Bi alloys comprising high volume fraction of Bi for high temperature soldering application. Cu-Bi alloys with 20, 40 and 60 vol% Bi are processed using liquid phase sintering (LPS). Effects of various sintering parameters, such as sintering time, temperature and relative green density, are studied to establish experimental conditions for preparing Cu-Bi alloys with optimum microstructure. Compression tests at different temperatures, ranging from RT to 260 degrees C, and strain rates, ranging from 5x10(-4) to 1 x 10(-2) s(-1), are conducted to assess effects of temperature, strain rate and Bi content on the overall mechanical response of the material. The sintered density increases with increase in the green density and, with some exception, also with the sintering period and the sintering temperature. On the other hand, overall densification decreases with green density. Yield strength and strain-hardening exponent of Cu-Bi alloys decrease with increase in both the mechanical testing temperature and the volume fraction of Bi in the alloy. In addition, a set value of strain rate sensitivity can also be attained by optimizing the Bi content in Cu-Bi alloy and the test temperature. Microstructurally aware finite element analysis is performed to gain insights into deformation processes. Finally, a rationale for using Cu-Bi alloys as high temperature solders is presented. (C) 2016 Elsevier B.V. All rights reserved.

Item Type:	Journal Article
Publication:	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Publisher:	ELSEVIER SCIENCE SA
Additional Information:	Copy right for this article belongs to the ELSEVIER SCIENCE SA, PO BOX 564, 1001 LAUSANNE, SWITZERLAND
Keywords:	Cu-Bi alloy; High temperature solders; Liquid phase sintering; Mechanical behavior; Microstructurally aware finite element analysis
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	08 Jul 2016 06:51
Last Modified:	08 Jul 2016 06:51
URI:	http://eprints.iisc.ac.in/id/eprint/54148

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