Vinayakumar, Kadayar B and Hegde, Gopal M and Ramachandra, Subbaraya G and Nayak, Mangalore M and Dinesh, NS and Rajanna, Konandur (2015) Development of cup shaped microneedle array for transdermal drug delivery. In: BIOINTERPHASES, 10 (2).
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Abstract
Microneedle technology is one of the attractive methods in transdermal drug delivery. However, the clinical applications of this method are limited owing to: complexity in the preparation of multiple coating solutions, drug leakage while inserting the microneedles into the skin and the outer walls of the solid microneedle can hold limited quantity of drug. Here, the authors present the fabrication of an array of rectangular cup shaped silicon microneedles, which provide for reduced drug leakage resulting in improvement of efficiency of drug delivery and possibility of introducing multiple drugs. The fabricated solid microneedles with rectangular cup shaped tip have a total height of 200 mu m. These cup shaped tips have dimensions: 60 x 60 mu m (length x breadth) with a depth of 60 mu m. The cups are filled with drug using a novel in-house built drop coating system. Successful drug dissolution was observed when the coated microneedle was used on mice. Also, using the above method, it is possible to fill the cups selectively with different drugs, which enables simultaneous multiple drug delivery. (C) 2015 American Vacuum Society.
Item Type: | Journal Article |
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Publication: | BIOINTERPHASES |
Publisher: | AMER INST PHYSICS |
Additional Information: | Copy right for this article belongs to the AMER INST PHYSICS, 1305 WALT WHITMAN RD, STE 300, MELVILLE, NY 11747-4501 USA |
Department/Centre: | Division of Biological Sciences > Centre for Ecological Sciences Division of Electrical Sciences > Electronic Systems Engineering (Formerly Centre for Electronic Design & Technology) Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics |
Date Deposited: | 31 Jul 2015 15:18 |
Last Modified: | 05 Mar 2019 11:07 |
URI: | http://eprints.iisc.ac.in/id/eprint/52000 |
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