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Anodization of sputtered metallic films: The microstructural connection

Choudhury, Tanushree H and Raghavan, Srinivasan (2015) Anodization of sputtered metallic films: The microstructural connection. In: SCRIPTA MATERIALIA, 105 . pp. 18-21.

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Official URL: http://dx.doi.org/10.1016/j.scriptamat.2015.04.017


A simple microstructural rationale for successful anodization of metallic films into ordered oxide nanostructures has been identified. It applies to three of the most commonly studied systems, Zr, Ti and Al films and can be extended to other such oxides. A dense Zone T or II microstructure, in sputtered films, is the most critical ingredient. While T-substrate > 0.3T(melting) Ching is the simplest route, pressure and plasma heating can also be exploited. Such microstructures are also associated with a unique growth stress signature. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Item Type: Journal Article
Additional Information: Copy right for this article belongs to the PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD OX5 1GB, ENGLAND
Keywords: Sputtering; Microstructure; Growth stress; Anodization
Department/Centre: Division of Chemical Sciences > Materials Research Centre
Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited: 31 Jul 2015 10:29
Last Modified: 31 Jul 2015 10:29
URI: http://eprints.iisc.ac.in/id/eprint/51941

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