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Low thermal conductivity of endogenous manganese silicide/Si composites for thermoelectricity

Perumal, S and Gorsse, S and Ail, Ujwala and Prakasarn, M and Vives, S and Decourt, R and Umarji, AM (2015) Low thermal conductivity of endogenous manganese silicide/Si composites for thermoelectricity. In: MATERIALS LETTERS, 155 . pp. 41-43.

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Official URL: http://dx.doi.org/10.1016/j.matlet.2015.04.098


Higher manganese silicide (HMS) based alloys with eutectic composition (Si-33.3 at% Mn) were prepared by arc-melting, melt-spinning and ball milling in order to evaluate the effect of microstructure on the thermal conductivity. Powder X-ray diffraction, SEM, EPMA and TEM analysis confirmed the presence of Si as a secondary phase distributed in the HMS matrix phase. Thermal properties of the samples were studied in the temperature range of 300-800 K. The microstructure refinement resulting from ball milling leads to a decrease of the thermal conductivity from 4.4 W/mK to 1.9 W/mK, whereas meltspinning is inefficient to this respect. The results show an opportunity to produce bulk higher manganese silicide alloys with reduced thermal conductivity in order to enhance its thermoelectric performance. (C) 2015 Elsevier B.V. All rights reserved.

Item Type: Journal Article
Additional Information: Copy right for this article belongs to the ELSEVIER SCIENCE BV, PO BOX 211, 1000 AE AMSTERDAM, NETHERLANDS
Keywords: Higher manganese silicides; Spark plasma sintering; Hot uni-axial pressing; Thermoelectric properties; Mechanical alloying
Department/Centre: Division of Chemical Sciences > Materials Research Centre
Date Deposited: 31 Jul 2015 10:13
Last Modified: 18 Feb 2019 11:04
URI: http://eprints.iisc.ac.in/id/eprint/51935

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