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Engineering a nanostructured ``super surface'' with superhydrophobic and superkilling properties

Hasan, Jafar and Raj, Shammy and Yadav, Lavendra and Chatterjee, Kaushik (2015) Engineering a nanostructured ``super surface'' with superhydrophobic and superkilling properties. In: RSC ADVANCES, 5 (56). pp. 44953-44959.

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Official URL: http://dx.doi.org/ 10.1039/c5ra05206h


We present a nanostructured ``super surface'' fabricated using a simple recipe based on deep reactive ion etching of a silicon wafer. The topography of the surface is inspired by the surface topographical features of dragonfly wings. The super surface is comprised of nanopillars 4 mm in height and 220 nm in diameter with random inter-pillar spacing. The surface exhibited superhydrophobicity with a static water contact angle of 154.0 degrees and contact angle hysteresis of 8.3 degrees. Bacterial studies revealed the bactericidal property of the surface against both gram negative (Escherichia coli) and gram positive (Staphylococcus aureus) strains through mechanical rupture of the cells by the sharp nanopillars. The cell viability on these nanostructured surfaces was nearly six-fold lower than on the unmodified silicon wafer. The nanostructured surface also killed mammalian cells (mouse osteoblasts) through mechanical rupture of the cell membrane. Thus, such nanostructured super surfaces could find applications for designing selfcleaning and anti-bacterial surfaces in diverse applications such as microfluidics, surgical instruments, pipelines and food packaging.

Item Type: Journal Article
Publication: RSC ADVANCES
Additional Information: Copy right for this article belongs to the ROYAL SOC CHEMISTRY, THOMAS GRAHAM HOUSE, SCIENCE PARK, MILTON RD, CAMBRIDGE CB4 0WF, CAMBS, ENGLAND
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited: 06 Jul 2015 05:33
Last Modified: 06 Jul 2015 05:33
URI: http://eprints.iisc.ac.in/id/eprint/51790

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