Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

Nair, Aswathi and Raghunandan, Karthik and Yaswant, Vaddi and Pillai, Sreelal S and Sambandan, Sanjiv (2015) Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards. In: APPLIED PHYSICS LETTERS, 106 (12).

PDF app_phy_let-106_12_2015.pdf - Published Version Restricted to Registered users only Download (2MB) | Request a copy

Abstract

We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 mu m/s with healed route having mean resistance of 8 k Omega across a 200 micron gap and depending on the materials and concentrations used. (C) 2015 AIP Publishing LLC.

Item Type:	Journal Article
Publication:	APPLIED PHYSICS LETTERS
Publisher:	AMER INST PHYSICS
Additional Information:	Copy right for this article belongs to the AMER INST PHYSICS, 1305 WALT WHITMAN RD, STE 300, MELVILLE, NY 11747-4501 USA
Keywords:	ELECTRICAL-CONDUCTIVITY; COPPER INTERCONNECTS; RESTORATION
Department/Centre:	Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics
Date Deposited:	28 Apr 2015 07:52
Last Modified:	28 Apr 2015 07:52
URI:	http://eprints.iisc.ac.in/id/eprint/51436

Actions (login required)

View Item