Effect of grain boundary engineering on the microstructure and mechanical properties of copper containing austenitic stainless steel

Sinha, Subhasis and Kim, Dong-Ik and Fleury, Eric and Suwas, Satyam (2015) Effect of grain boundary engineering on the microstructure and mechanical properties of copper containing austenitic stainless steel. In: MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 626 . pp. 175-185.

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Abstract

The present investigation deals with grain boundary engineering of a modified austenitic stainless steel to obtain a material with enhanced properties. Three types of processing that are generally in agreement with the principles of grain boundary engineering were carried out. The parameters for each of the processing routes were fine-tuned and optimized. The as-processed samples were characterized for microstructure and texture. The influence of processing on properties was estimated by evaluating the room temperature mechanical properties through micro-tensile tests. It was possible to obtain remarkably high fractions of CSL boundaries in certain samples. The results of the micro-tensile tests indicate that the grain boundary engineered samples exhibited higher ductility than the conventionally processed samples. The investigation provides a detailed account of the approach to be adopted for GBE processing of this grade of steel. (C) 2014 Elsevier B.V. All rights reserved.

Item Type:	Journal Article
Publication:	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Publisher:	ELSEVIER SCIENCE SA
Additional Information:	Copy right for this article belongs to the ELSEVIER SCIENCE SA, PO BOX 564, 1001 LAUSANNE, SWITZERLAND
Keywords:	Austenitic stainless steel; Grain boundary engineering; Texture; Mechanical properties
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	20 Apr 2015 07:05
Last Modified:	20 Apr 2015 07:05
URI:	http://eprints.iisc.ac.in/id/eprint/51235

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