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Probabilistic stress variation studies on composite single lap joint using Monte Carlo simulation

Kumar, Vijaya RL and Bhat, MR (2015) Probabilistic stress variation studies on composite single lap joint using Monte Carlo simulation. In: COMPOSITE STRUCTURES, 121 . pp. 351-361.

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Official URL: http://dx.doi.org/ 10.1016/j.compstruct.2014.11.02...


The work presented in this paper involves the stochastic finite element analysis of composite-epoxy adhesive lap joints using Monte Carlo simulation. A set of composite adhesive lap joints were prepared and loaded till failure to obtain their strength. The peel and shear strain in the bond line region at different levels of load were obtained using digital image correlation (DIC). The corresponding stresses were computed assuming a plane strain condition. The finite element model was verified by comparing the numerical and experimental stresses. The stresses exhibited a similar behavior and a good correlation was obtained. Further, the finite element model was used to perform the stochastic analysis using Monte Carlo simulation. The parameters influencing stress distribution were provided as a random input variable and the resulting probabilistic variation of maximum peel and shear stresses were studied. It was found that the adhesive modulus and bond line thickness had significant influence on the maximum stress variation. While the adherend thickness had a major influence, the effect of variation in longitudinal and shear modulus on the stresses was found to be little. (C) 2014 Elsevier Ltd. All rights reserved.

Item Type: Journal Article
Additional Information: Copy right for this article belongs to the ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD OX5 1GB, OXON, ENGLAND
Keywords: Composites; Adhesive joints; Digital image correlation; Monte Carlo simulation
Department/Centre: Division of Mechanical Sciences > Aerospace Engineering(Formerly Aeronautical Engineering)
Date Deposited: 28 Feb 2015 07:07
Last Modified: 28 Feb 2015 07:07
URI: http://eprints.iisc.ac.in/id/eprint/50930

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