Numerical modeling of the non-isothermal liquid droplet impact on a hot solid substrate

Ganesan, Sashikumaar and Rajasekaran, Sangeetha and Tobiska, Lutz (2014) Numerical modeling of the non-isothermal liquid droplet impact on a hot solid substrate. In: INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 78 . pp. 670-687.

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Abstract

The heat transfer from a solid phase to an impinging non-isothermal liquid droplet is studied numerically. A new approach based on an arbitrary Lagrangian-Eulerian (ALE) finite element method for solving the incompressible Navier Stokes equations in the liquid and the energy equation within the solid and the liquid is presented. The novelty of the method consists in using the ALE-formulation also in the solid phase to guarantee matching grids along the liquid solid interface. Moreover, a new technique is developed to compute the heat flux without differentiating the numerical solution. The free surface and the liquid solid interface of the droplet are represented by a moving mesh which can handle jumps in the material parameter and a temperature dependent surface tension. Further, the application of the Laplace-Beltrami operator technique for the curvature approximation allows a natural inclusion of the contact angle. Numerical simulation for varying Reynold, Weber, Peclet and Biot numbers are performed to demonstrate the capabilities of the new approach. (C) 2014 Elsevier Ltd. All rights reserved.

Item Type:	Journal Article
Publication:	INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Publisher:	PERGAMON-ELSEVIER SCIENCE LTD
Additional Information:	Copy right for this article belongs to the PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD OX5 1GB, ENGLAND
Keywords:	Finite elements; ALE approach; Moving mesh; Impinging droplets; Moving contact line; Dynamic contact angle; Heat transfer
Department/Centre:	Division of Chemical Sciences > Solid State & Structural Chemistry Unit
Date Deposited:	12 Nov 2014 04:58
Last Modified:	12 Nov 2014 04:58
URI:	http://eprints.iisc.ac.in/id/eprint/50216

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