Temperature-dependent stability of stacking faults in Al, Cu and Ni: first-principles analysis

Bhogra, Meha and Ramamurty, U and Waghmare, Umesh V (2014) Temperature-dependent stability of stacking faults in Al, Cu and Ni: first-principles analysis. In: JOURNAL OF PHYSICS-CONDENSED MATTER, 26 (38).

PDF jou_phy_con_mat_26-38_2014.pdf - Published Version Restricted to Registered users only Download (1MB) | Request a copy

Abstract

We present comparative analysis of microscopic mechanisms relevant to plastic deformation of the face-centered cubic (FCC) metals Al, Cu, and Ni, through determination of the temperature-dependent free energies of intrinsic and unstable stacking faults along 1 (1) over bar 0] and 1 (2) over bar 1] on the (1 1 1) plane using first-principles density-functional-theory-based calculations. We show that vibrational contribution results in significant decrease in the free energy of barriers and intrinsic stacking faults (ISFs) of Al, Cu, and Ni with temperature, confirming an important role of thermal fluctuations in the stability of stacking faults (SFs) and deformation at elevated temperatures. In contrast to Al and Ni, the vibrational spectrum of the unstable stacking fault (USF1 (2) over bar 1]) in Cu reveals structural instabilities, indicating that the energy barrier (gamma(usf)) along the (1 1 1)1 (2) over bar 1] slip system in Cu, determined by typical first-principles calculations, is an overestimate, and its commonly used interpretation as the energy release rate needed for dislocation nucleation, as proposed by Rice (1992 J. Mech. Phys. Solids 40 239), should be taken with caution.

Item Type:	Journal Article
Publication:	JOURNAL OF PHYSICS-CONDENSED MATTER
Additional Information:	Copy right for this article belongs to the IOP PUBLISHING LTD, TEMPLE CIRCUS, TEMPLE WAY, BRISTOL BS1 6BE, ENGLAND
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	15 Oct 2014 04:56
Last Modified:	15 Oct 2014 04:56
URI:	http://eprints.iisc.ac.in/id/eprint/50012

Actions (login required)

View Item