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Hot deformation behavior of Ni-Fe-Ga-based ferromagnetic shape memory alloy - A study using processing map

Biswas, Aniruddha and Singh, Gaurav and Sarkar, Sudip Kumar and Krishnan, Madangopal and Ramamurty, Upadrasta (2014) Hot deformation behavior of Ni-Fe-Ga-based ferromagnetic shape memory alloy - A study using processing map. In: INTERMETALLICS, 54 . pp. 69-78.

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Official URL: http://dx.doi.org/ 10.1016/j.intermet.2014.05.012


Ni-Fe-Ga-based alloys form a new class of ferromagnetic shape memory alloys (FSMAs) that show considerable formability because of the presence of a disordered fcc gamma-phase. The current study explores the deformation processing of this alloy using an off-stoichiometric Ni55Fe59Ga26 alloy that contains the ductile gamma-phase. The hot deformation behavior of this alloy has been characterized on the basis of its flow stress variation obtained by isothermal constant true strain rate compression tests in the 1123-1323 K temperature range and strain rate range of 10(-3)-10 s(-1) and using a combination of constitutive modeling and processing map. The dynamic recrystallization (DRX) regime for thermomechanical processing has been identified for this Heusler alloy on the basis of the processing maps and the deformed microstructures. This alloy also shows evidence of dynamic strain-aging (DSA) effect which has not been reported so far for any Heusler FSMAs. Similar effect is also noticed in a Ni-Mn-Ga-based Heusler alloy which is devoid of any gamma-phase. (C) 2014 Elsevier Ltd. All rights reserved.

Item Type: Journal Article
Additional Information: Copy right for this article belongs to the ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD OX5 1GB, OXON, ENGLAND
Keywords: Shape-memory alloys; Deformation map; Dynamic recrystallization; Martensitic transformation; Strain-aging; Microstructure
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 24 Sep 2014 05:47
Last Modified: 24 Sep 2014 05:47
URI: http://eprints.iisc.ac.in/id/eprint/49914

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