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Phase Evolution in the AuCu/Sn System by Solid-State Reactive Diffusion

Santra, Sangeeta and Islam, Sarfaraj and Ravi, Raju and Vuorinen, Vesa and Laurila, Tomi and Paul, Aloke (2014) Phase Evolution in the AuCu/Sn System by Solid-State Reactive Diffusion. In: JOURNAL OF ELECTRONIC MATERIALS, 43 (9). pp. 3357-3371.

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Official URL: http://dx.doi.org/ 10.1007/s11664-014-3241-z


The interfacial reactions between several Au(Cu) alloys and pure Sn were studied experimentally at 200A degrees C. Amounts of Cu in the AuSn4 and AuSn2 phases were as low as 1 at.%. On the basis of these experimental results there is no continuous solid solution between (Au,Cu)Sn and (Cu,Au)(6)Sn-5. The copper content of (Au,Cu)Sn was determined to be approximately 7-8 at.%. Substantial amounts of Au were present in the (Cu,Au)(6)Sn-5 and (Cu,Au)(3)Sn phases. Two ternary compounds were formed, one with stoichiometry varying from (Au40.5Cu39)Sn-20.5 to (Au20.2Cu59.3)Sn-20.5 (ternary ``B''), the other with the composition Au34Cu33Sn33 (ternary ``C''). The measured phase boundary compositions of the product phases are plotted on the available Au-Cu-Sn isotherm and the phase equilibria are discussed. The complexity and average thickness of the diffusion zone decreases with increasing Cu content except for the Au(40 at.%Cu) couple.

Item Type: Journal Article
Additional Information: Copy right for this article belongs to the SPRINGER, 233 SPRING ST, NEW YORK, NY 10013 USA
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 18 Sep 2014 09:09
Last Modified: 18 Sep 2014 09:09
URI: http://eprints.iisc.ac.in/id/eprint/49888

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