Phase Evolution in the AuCu/Sn System by Solid-State Reactive Diffusion

Santra, Sangeeta and Islam, Sarfaraj and Ravi, Raju and Vuorinen, Vesa and Laurila, Tomi and Paul, Aloke (2014) Phase Evolution in the AuCu/Sn System by Solid-State Reactive Diffusion. In: JOURNAL OF ELECTRONIC MATERIALS, 43 (9). pp. 3357-3371.

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Abstract

The interfacial reactions between several Au(Cu) alloys and pure Sn were studied experimentally at 200A degrees C. Amounts of Cu in the AuSn4 and AuSn2 phases were as low as 1 at.%. On the basis of these experimental results there is no continuous solid solution between (Au,Cu)Sn and (Cu,Au)(6)Sn-5. The copper content of (Au,Cu)Sn was determined to be approximately 7-8 at.%. Substantial amounts of Au were present in the (Cu,Au)(6)Sn-5 and (Cu,Au)(3)Sn phases. Two ternary compounds were formed, one with stoichiometry varying from (Au40.5Cu39)Sn-20.5 to (Au20.2Cu59.3)Sn-20.5 (ternary ``B''), the other with the composition Au34Cu33Sn33 (ternary ``C''). The measured phase boundary compositions of the product phases are plotted on the available Au-Cu-Sn isotherm and the phase equilibria are discussed. The complexity and average thickness of the diffusion zone decreases with increasing Cu content except for the Au(40 at.%Cu) couple.

Item Type:	Journal Article
Publication:	JOURNAL OF ELECTRONIC MATERIALS
Additional Information:	Copy right for this article belongs to the SPRINGER, 233 SPRING ST, NEW YORK, NY 10013 USA
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	18 Sep 2014 09:09
Last Modified:	18 Sep 2014 09:09
URI:	http://eprints.iisc.ac.in/id/eprint/49888

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