ePrints@IIScePrints@IISc Home | About | Browse | Latest Additions | Advanced Search | Contact | Help

Packaging of Polyvinylidene fluoride nasal sensor for biomedical applications

Manjunatha, Roopa G and Rajanna, K and Nayak, MM (2013) Packaging of Polyvinylidene fluoride nasal sensor for biomedical applications. In: 8th International Microsystems, Packaging, Assembly and Circuits Technology, OCT 22-25, 2013, Taipei, TAIWAN, pp. 356-358.

[img] PDF
int_mic_pac_ass_cir_tec_con_356_2103.pdf - Published Version
Restricted to Registered users only

Download (737kB) | Request a copy
Official URL: http://dx.doi.org/10.1109/IMPACT.2013.6706625


This paper presents the design technique that has been adopted for packaging of Polyvinylidene fluoride (PVDF) nasal sensor for biomedical applications. The PVDF film with the dimension of length 10mm, width 5mm and thickness 28 mu m was firmly adhered on one end of plastic base (8mmx5mmx30 mu m) in such a way that it forms a cantilever configuration leaving the other end free for deflection. Now with the leads attached on the surface of the PVDF film, the cantilever configuration becomes the PVDF nasal sensor. For mounting a PVDF nasal sensor, a special headphone was designed, that can fit most of the human head sizes. Two flexible strings are soldered on either side of the headphone. Two identical PVDF nasal sensors were then connected to either side of flexible string of the headphone in such a way that they are placed below the right and left nostrils respectively without disturbing the normal breathing. When a subject wares headphone along with PVDF nasal sensors, two voltage signals due to the piezoelectric property of the PVDF film were generated corresponding to his/her nasal airflow from right and left nostril. The entire design was made compact, so that PVDF nasal sensors along with headphone can be made portable. No special equipment or machines are needed for mounting the PVDF nasal sensors. The time required for packaging of PVDF nasal sensors was less and the approximate cost of the entire assembly (PVDF nasal sensors + headphone) was very nominal.

Item Type: Conference Proceedings
Series.: International Microsystems Packaging Assembly and Circuits Technology Conference
Publisher: IEEE
Additional Information: Copyright for this article belongs to the IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Department/Centre: Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics
Date Deposited: 13 Jun 2014 05:59
Last Modified: 13 Jun 2014 05:59
URI: http://eprints.iisc.ac.in/id/eprint/48965

Actions (login required)

View Item View Item