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Characterization and Performance Study of Packaged Micropump for Drug Delivery

Kumar, Vinaya KB and Nayak, MM and Dinesh, NS and Rajanna, K (2013) Characterization and Performance Study of Packaged Micropump for Drug Delivery. In: 8th International Microsystems, Packaging, Assembly and Circuits Technology , OCT 22-25, 2013, Taipei, TAIWAN, pp. 353-355.

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Abstract

In this work, we present the characterization and performance studies of self-priming peristaltic pump for drug delivery application. Conventional materials and methods have been used to fabricate single cam mechanism based peristaltic micropump. To control the fluid flow precisely in micro liter range, a single cam mechanism has been used instead of conventional roller mechanism. The fabricated pump is suitable for liquid, gas and foam. Using water as a fluid medium, a flow rate of 12.5 mu l/rpm is achieved using a flexible silicone tube of inner diameter 1.5 mm and outer diameter 2.5 mm. Other than water, higher viscosity fluids showed a decrease in the flow rate. The designed micropump exhibits a linear dependence of flow rate in the voltage range of 2.5V to 5V. Drug delivery using micropump demands that the micropump has to pump against the blood pressure (maximum of 25kPa) with constant flow rate. Here the designed pump is able to pump the liquid with a constant flow rate of 500 mu l/min (water) up to a backpressure of 40kPa. It was observed that, by increasing the backpressure above 40kPa, flow rate of the pump gradually decreased to 125 mu l/min at 120kPa. In addition, Micropump based drug delivery demands that the micropump should be normally in closed condition in all the positions to avoid drug leakage and bleeding. Hence, micropump has been characterized for normally closed condition in all positions (0 degrees to 360 degrees). However, a minute leak of 0.14 % was found for an inlet pressure of 140kPa. Also, the normally closed region with no leak is observed up to 60kPa of pressure in all positions (0 degrees to 360 degrees).

Item Type: Conference Proceedings
Series.: International Microsystems Packaging Assembly and Circuits Technology Conference
Publisher: IEEE
Additional Information: Copyright for this article belongs to the IEEE, USA
Department/Centre: Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics
Date Deposited: 23 May 2014 06:30
Last Modified: 23 May 2014 06:31
URI: http://eprints.iisc.ac.in/id/eprint/48964

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